WB-EDM-G-IMX8M-PLUS

  • NXP i.MX 8M Plus applications processor
  • Up to 4 Cortex-A53 1.8 GHz processors
  • Cortex-M7 processor with speeds up to 800 MHz
  • Neural Processing Unit (NPU)
  • Image Signal Processor (ISP)
  • Armv8 64-Bit CPU cores

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Highlights

64-bit Performance

64-bit ARMv8 Cortex-A53 cores with a modern graphical user interface designed for typical industrial and medical applications.

Rugged and Reliable

Operates reliably in harsh industrial environments and conditions, such as strong vibrations, extreme temperatures and wet or dusty conditions.

Camera Integration

Machine Vision camera modules and complete off-the-shelf solutions available from TechNexion. Seamless integration and optimized from the first day of your project.

Certified Connectivity

Simplify your design with pre-certified wireless options - from the module to the antennas - and make end-device certification processes more predictable while cutting costs.

Software Platform

We advocate Open Source Software and support Linux, Ubuntu, Yocto and Android. Perfect solutions to success can be tailored easily.

Interfaces

Packed with a wide array of interfaces. Our System-on-Modules are as a Swiss Army knife when connecting over serial port, CAN bus, I2C, SPI or USB.

Machine Learning AI

The integrated neural network processing unit (NPU) was designed from the ground up to execute deep learning inference, and to outperform CPU- and GPU-based solutions in the same power range by several times.

Pin Compatibility

Scalability at it's finest is what sets TechNexion System-on-Modules apart. A single carrier board can host from a low-power i.MX8M Nano to a powerful SOC with integrated NPU that the i.MX8M Plus brings to the EDM System-on-Module family.

Core System
Processor

NXP i.MX8M Plus

Architecture

ARM Cortex-A53 + M7

AI / ML

NN Accel 2.3 TOPS

PMIC

NXP PCA9450

Memory

Upto 8GB LPDDR4

Storage

32GB eMMC (default)

Board-to-Board Connector

260-pin DDR4 SO-DIMM

System on Module

EDM SOM

Debug Interface

JTAG Interface by Through-hole

Connectivity
Network LAN

1x Realtek RTL8211F

Wi-Fi

Qualcomm Atheros QCA9377 Wi-Fi 5 – 802.11 a/b/g/n/ac

Bluetooth

Qualcomm Atheros QCA9377 Bluetooth

Antenna

MHF4 connector

Signaling
HDMI

1x (HDMI 2.0a, up to 4K)

LVDS

1x Dual Channel LVDS (up to 1920×1080)

MIPI DSI

1x Quad Lane MIPI DSI (up to 1920×1080)

MIPI CSI2

2x Quad Lane MIPI CSI-2

LAN

Gigabit with TSN (+2nd RGMII)

PCIe

1 (x1 Gen 3)

USB 3.1

1x Host / 1x OTG (Gen 1)

USB 2.0

1x Host / 1x OTG

I²S

6x SAI: I2S or AC97

PDM

4x lane

S/PDIF

1x TX/RX

CAN

2x (CAN FD)

UART

4x

SPI

2x

I²C

6x

SDIO/SD/MMC

1x

PWM

4x

GPIO

86x

JTAG

thruhole on Module

Certification and Compliance
FCC

FCC ID: 2AKZA-QCA9377

IC

IC: 22364-QCA9377

CE

EN 300 328 v2.2.2
EN 301 893 v2.1.1
EN 55032 / EN 55024

TELEC (Japan)

TELEC: 201-180629

RCM (Australia/New Zealand)

RCM Compliant

Certification

Compliant with RoHS / REACH directives

Bluetooth Logo

QDID 150839 (Bluetooth 4.2)
QDID 150839 (Bluetooth 5)

WB-EDM-G-IMX8M-PLUS Block Diagram
WB-EDM-G-IMX8M-PLUS Dimensions

Getting Started With Your Evaluation Kit

Embedded Vision

Your Evaluation Kit is Compatible with TechNexion Embedded Vision Camera Modules.

  • BSP Driver Support
    • Android
    • Linux Kernel
    • Yocto
    • Ubuntu

Vizionlink Ready

Using the EDM-G-IMX8M-PLUS in Machine Vision projects has never been easier. Start working with TechNexion Vizionlink™ embedded vision products.

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