The EDM Module Family offers a scalable compact formfactor System-on-Module using a 260 pin SO-DIMM edge connector for embedded systems. Designed to meet complex application requirements, these modules combine powerful processors, standardized connectivity, and integrated components to simplify development and accelerate time to market.
Get all the essential specs in one place.
Our catalog includes detailed mechanical drawings, I/O interfaces, wireless certifications for everything you need to evaluate and integrate EDM modules into your next project.
Faster Time to Market
A complete design that is ready to deploy assists you to focus on application from day one. Helping you to bring products to your customers much faster.
Longevity
15+ years availability from the start of production ensuring the same product to be available during the lifetime of your embedded project.
Scalable and Pin-Compatible
A complete family stretching multiple generations of SOC technology enabling true scalability and futureproof your design.
Sourcecode Software
Yocto Linux, Debian or Android sourcecode can be easily obtained from our github account for seamless development.
Comprehensive Interface
Packed with versatile interfaces, including serial ports, CAN bus, I2C, SPI, and USB, for diverse connectivity.
Pre-Certified Wi-Fi
Pre-certified wireless options simplify design and reduce costs for end-device certifications.
Camera-Ready
Seamless integration with TechNexion vision modules — built for machine vision, robotics, and edge AI from day one.
Online Technical Help
Provides expert resources and guidance to streamline development and integration.
| Feature | AXON | EDM | PICO |
|---|---|---|---|
| Connector | 4*80-pin Hirose connectors | 260-pin Edge connectors | 70-pin Hirose connectors |
| Size | 58 x 37 mm | 69.6 x 35 mm | 37 x 40 mm |
| Key Advantages | Interface Superset | Low-cost single connector | Smallest size |
| Applications | • Edge Computing • Vehicle vision applications • Drone / UAV / Robotics | • General Embedded • Edge AI / Vision Applications • Smart manufacturing | • Small compact embedded devices • Vibration prone applications • Low-power mobile applications |
Proof of concept within a day. It’s possible with TechNexion’s System on Module Starter kits that bring all bits of hardware to the table. Backed up with demo Yocto, Linux and Debian pre-installed on your evaluation kit and take literally a minute to boot after you receive your kit on your doorstep.
Need a touch display or a camera solution? You can easily add these to the kit and software driver is already made available, assisting you quickly with your proof of concept validation steps.
Integration of Embedded vision camera sensors in your system with TechNexion SOMs is made easy with the TechNexion unified camera driver that comes pre-installed and packaged with your TechNexion System-on-Module.
All TechNexion Embedded Vision products are supported with VizionViewer and VizionSDK, giving your engineering team full control over the camera settings by using C# or Python.
TechNexion offers comprehensive online support with detailed manuals, quick start guides, and FAQs to help you integrate and deploy EDM modules with ease.
Whether you’re at the prototyping or production stage, everything you need is just a click away to streamline your development process.
Yocto, Linux, Debian, or Android source code can be easily accessed through our official GitHub repository, enabling seamless development and integration. With complete BSPs, build instructions, and driver support, developers can customize systems with confidence.
Our open-source approach ensures transparency, flexibility, and faster innovation, whether you’re building embedded applications for industrial, medical, or consumer use.
Building a custom carrier board? TechNexion provides reference schematics and professional design review services to help you reduce hardware risks and ensure compatibility.
Whether you’re a beginner or an experienced developer, we support you in making your design work right the first time.
All EDM modules feature globally pre-certified Wi-Fi and Bluetooth connectivity. This eliminates the need for additional RF certifications, allowing faster time-to-market and reduced costs. Enjoy seamless and reliable wireless performance with minimal engineering effort.
| Part Number | Processor | Memory | Storage | WiFi / Bluetooth | Operating temperature | Family |
|---|---|---|---|---|---|---|
| EDM-IMX95 | NXP i.MX95 | Up to 16GB LPDDR5 | 32GB eMMC | WiFi 6 + BT 5.3 (IW611) | -40°C to +85°C | EDM |
| EDM-IMX93 | NXP i.MX93 | Up to 2GB LPDDR4x | 32GB eMMC | WiFi 4 + BT 5.2 (IW416) | -40°C to +85°C | EDM |
| EDM-IMX91 | NXP i.MX91 | 1GB LPDDR4 | 16GB eMMC | WiFi 4 + BT 5.2 (IW416) | 0°C to +60°C | EDM |
| EDM-IMX8M-PLUS | NXP i.MX8M Plus | Up to 8GB LPDDR4 | 32GB eMMC | WiFi 5 + BT 5 | -40°C to +85°C | EDM |
| EDM-IMX8M-MINI | NXP i.MX8M Mini | Up to 8GB LPDDR4 | 32GB eMMC | WiFi 5 + BT 5 | -40°C to +85°C | EDM |
| EDM-IMX8M-NANO | NXP i.MX8M Nano | Up to 2GB LPDDR4 | 32GB eMMC | WiFi 5 + BT 5 | 0°C to +60°C | EDM |
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