TechNexion
Taiwan
8536.90.8585
EAR99
740.17(b)(1) Mass Market (No License Required)
YES
PICO LOW-PROFILE HEATSINK 6MM + THERMOPAD WITH 0.75 MM THICKNESS FOR NXP i.MX6 QUAD LIDDED OR i.MX8M
PICO LOW-PROFILE HEATSINK 6MM + THERMOPAD WITH 1.50 MM THICKNESS FOR NXP i.MX6 UL/ULL OR i.MX6 QUAD UNLIDDED or i.MX7
PICO HEATSINK 12MM + THERMOPAD WITH 1.25 MM THICKNESS FOR NXP i.MX6 SOLO OR DUALLITE
7 INCH 1024 x 600 RESISTIVE 4 WIRE TOUCH 250 NITS LCD PANEL INCLUDING ADAPTOR AND CABLES TO CONNECT TO EDM EVALUATION BOARDS
EDM COMPACT 12 MM PASSIVE HEATSINK + 20*20 MM THERMOPAD WITH 0.75 MM THICKNESS FOR NXP I.MX6 DUAL / QUAD / QUADPLUS LIDDED OR I.MX8M
PICO HEATSINK 12MM + THERMOPAD WITH 0.75 MM THICKNESS FOR NXP i.MX6 QUAD LIDDED OR i.MX8M
USB 2.0 MICRO USB TO TYPE A CABLE 100CM