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EDM-IMX95-D

  • NXP i.MX 95 applications processor
  • Up to 6 Cortex-A55 processors
  • Ultra-fast 16GB LPDDR5
  • Neural Processing Unit (NPU)
  • Image Signal Processor (ISP)
  • Virtual channel camera support (8 cameras)

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Product Brief
Developer Page
EDM-IMX95 TOP
EDM-IMX95 BACK

EDM-IMX95-D Highlights

Six Core Processor

Sourcecode Software

We advocate Open Source Software and support Linux, Yocto and Debian. Perfect solutions to success can be tailored easily.

Rugged and Reliable

Embedded Vision

Scalability

Edge AI

Wi-Fi 6 / BT5.3

Time to Market

Specifications

Core System
Processor

NXP i.MX95

Architecture

6x Arm Cortex-A55 + Arm Cortex-M33 + Arm Cortex-M7

PMIC

NXP MPF0900
NXP MPF5301
NXP MPF5302

Memory

Upto 16GB LPDDR5

Storage

32GB eMMC (default)

Board-to-Board Connector

260-pin DDR4 SO-DIMM

System on Module

EDM SOM

Debug Interface

UART Interface by Through-hole
AI / Vision Capabilities
NPU / AI

8 eTOPS @ 1 GHz

Camera

MIPI CSI (4 lanes)
Connectivity
Network LAN

1x Realtek RTL8211

Wi-Fi

NXP IW611 Wi-Fi 6 – 802.11 a/b/g/n/ac/ax (optional)

Bluetooth

NXP IW611 Bluetooth (optional)

Antenna

MHF4 connector (optional)
Signaling
LVDS

1x Dual Channel LVDS (up to 1920×1080)

MIPI DSI

1x MIPI DSI or 1x MIPI CSI-2

MIPI CSI2

1x

LAN

1x

PCIe

2x (Gen 3×1)

USB 3.1

1x (Gen 1)

USB 2.0

1x

I²S

2x

CAN

2x

UART

3x

SPI

1x

I²C

5x

SDIO/SD/MMC

1x SDIO

PWM

1x

GPIO

5x

JTAG

1x

I³C

1x

RGMII

1x

USXGMII

1x
Video
GPU Engine

2D GPU
Arm Mali-G310 Graphic Processing Unit
3D GPU supporting 64 GFLOPs FP32
OpenGL® ES 3.2
Vulkan® 1.3
OpenCL™ 3.0

2D Acceleration

Yes

3D Acceleration

Yes

Video Decode

4Kp60 H.265 and H.264

Video Encode

4Kp60 H.265 and H.264
Audio
Audio Codec

On carrier board

Audio Interface

I²S
Power Specifications
Power Input

5V DC +/-5%

Power Consumption

Depending on Configuration
Software Support
Standard Support

Linux
Yocto
Debian
Android
Environmental and Mechanical
Dimensions

69.6 (W) x 35 (H) x 6.25 (D) mm

Weight

13 grams

Form Factor

EDM

MTBF

100,000+ Hours

Shock

15G half-sine 11 ms duration

Vibration

1 Grms random 5-500Hz hr/axis

Relative Humidity

10 to 90 %

Operation Temperature

Commercial: 0°C to +60°C
Industrial: -40°C to +85°C
Commercial Information
Brand

TechNexion

Country of Origin

Taiwan

HTSN

8473.30.1180

ECCN

EAR99

CCATS

740.17(b)(1) Mass Market (No License Required)

Blockdiagram

Dimensions

Movie Vault

Embedded Vision

TechNexion Embedded Vision Camera Sensors are available from 1MP to 13MP with rolling or global shutter functionality. The best of all. All TEVS sensors are pin-to-pin compatible.

Learn More

Documentation

Getting Started

Product Brief

Product Datasheet  

EDM Product Family

TechNexion Software Loader

OS Support

Yocto

Debian (coming soon)

Source Code

Linux

Yocto

Mechanical

DXF File  

STP 3D File  

PCB Footprint  

Carrier Board

Schematics  

PCB Layout  

Gerber File  

Certification

Declaration of Conformity

RoHS / REACH

Conflict Minerals

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