PICO LOW-PROFILE HEATSINK 6MM + THERMOPAD WITH 0.75 MM THICKNESS FOR NXP i.MX6 QUAD LIDDED OR i.MX8M
Available on backorder
TechNexion
Taiwan
8708.91.7550
EAR99
740.17(b)(1) Mass Market (No License Required)
YES
EDM COMPACT 12 MM PASSIVE HEATSINK + 20*20 MM THERMOPAD WITH 1.25 MM THICKNESS FOR NXP I.MX6 SOLO / DUALLITE
PICO HEATSINK 12MM + THERMOPAD WITH 0.75 MM THICKNESS FOR NXP i.MX6 QUAD LIDDED OR i.MX8M
7 INCH 1024 x 600 RESISTIVE 4 WIRE TOUCH 250 NITS LCD PANEL INCLUDING ADAPTOR AND CABLES TO CONNECT TO EDM EVALUATION BOARDS
30 PICO CONNECTOR (D40HC(3.0)-70DS-O.4V(51)) + 30 SCREWS + 60 NUTS
5 INCH 720 x 1280 MIPI LCD WITH PCAP TOUCH PANEL