TechNexion
USBUART330TTLFTDI100
Taiwan
8544.42.2000
EAR99
740.17(b)(1) Mass Market (No License Required)
YES
More info
EDM COMPACT 12 MM PASSIVE HEATSINK + 20*20 MM THERMOPAD WITH 0.75 MM THICKNESS FOR NXP I.MX6 DUAL / QUAD / QUADPLUS LIDDED OR I.MX8M
7 INCH 1024 x 600 PCAP MULTI TOUCH LCD PANEL INCLUDING ADAPTOR AND CABLES
PICO LOW-PROFILE HEATSINK 6MM + THERMOPAD WITH 0.75 MM THICKNESS FOR NXP i.MX6 QUAD LIDDED OR i.MX8M
PICO LOW-PROFILE HEATSINK 6MM + THERMOPAD WITH 1.25 MM THICKNESS FOR NXP i.MX6 SOLO OR DUALLITE
