TechNexion
USBUART330TTLFTDI100
Taiwan
8544.42.2000
EAR99
740.17(b)(1) Mass Market (No License Required)
Yes
PICO LOW-PROFILE HEATSINK 6MM + THERMOPAD WITH 1.25 MM THICKNESS FOR NXP i.MX6 SOLO OR DUALLITE
30 PICO CONNECTOR (D40HC(3.0)-70DS-O.4V(51)) + 30 SCREWS + 60 NUTS
EDM COMPACT 12 MM PASSIVE HEATSINK + 20*20 MM THERMOPAD WITH 1.50 MM THICKNESS FOR NXP I.MX6UL / ULL OR I.MX6 DUAL / QUAD / QUADPLUS UNLIDDED OR I.MX7
EDM COMPACT 12 MM PASSIVE HEATSINK + 20*20 MM THERMOPAD WITH 1.25 MM THICKNESS FOR NXP I.MX6 SOLO / DUALLITE
PICO LOW-PROFILE HEATSINK 6MM + THERMOPAD WITH 1.50 MM THICKNESS FOR NXP i.MX6 UL/ULL OR i.MX6 QUAD UNLIDDED or i.MX7