TechNexion
EDMHS12M2T2020075KIT
EDMHS12M2T2020075KIT

EDMHS12M2T2020075KIT

EDM COMPACT 12 MM PASSIVE HEATSINK + 20*20 MM THERMOPAD WITH 0.75 MM THICKNESS FOR NXP I.MX6 DUAL / QUAD / QUADPLUS LIDDED OR I.MX8M

Quantity Price
1 - 49 $10.00
50 - 99 $9.60
100+ $9.36
x

Additional information

Shop Data
Brand

TechNexion

Country of Origin

Taiwan

HTSN

8708.91.7550

ECCN

EAR99

CCATS

Mass Market (No License Required)

REACH / RoHS

YES

EDMHS12M Dimensions

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PICO LOW-PROFILE HEATSINK 6MM + THERMOPAD WITH 1.50 MM THICKNESS FOR NXP i.MX6 UL/ULL OR i.MX6 QUAD UNLIDDED or i.MX7

EDMHS12M2T2020150KIT

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EDM COMPACT 12 MM PASSIVE HEATSINK + 20*20 MM THERMOPAD WITH 1.50 MM THICKNESS FOR NXP I.MX6UL / ULL OR I.MX6 DUAL / QUAD / QUADPLUS UNLIDDED OR I.MX7

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