TechNexion
Taiwan
8708.91.7550
EAR99
740.17(b)(1) Mass Market (No License Required)
YES
More info
PICO LOW-PROFILE HEATSINK 6MM + THERMOPAD WITH 1.50 MM THICKNESS FOR NXP i.MX6 UL/ULL OR i.MX6 QUAD UNLIDDED or i.MX7
5 INCH 800 x 480 PCAP MULTI TOUCH LCD PANEL INCLUDING TTL ADAPTOR AND CABLES
PICO HEATSINK 12MM + THERMOPAD WITH 1.75 MM THICKNESS FOR NXP i.MX8M MINI
EDM COMPACT 12 MM PASSIVE HEATSINK + 20*20 MM THERMOPAD WITH 0.75 MM THICKNESS FOR NXP I.MX6 DUAL / QUAD / QUADPLUS LIDDED OR I.MX8M
