TechNexion
Taiwan
8708.91.7550
EAR99
740.17(b)(1) Mass Market (No License Required)
Yes
USB 3.0 TYPE C TO TYPE A CABLE 100CM
EDM COMPACT 12 MM PASSIVE HEATSINK + 20*20 MM THERMOPAD WITH 1.25 MM THICKNESS FOR NXP I.MX6 SOLO / DUALLITE
PICO LOW-PROFILE HEATSINK 6MM + THERMOPAD WITH 1.50 MM THICKNESS FOR NXP i.MX6 UL/ULL OR i.MX6 QUAD UNLIDDED or i.MX7
7 INCH 800 x 480 PCAP MULTI TOUCH LCD PANEL INCLUDING TTL ADAPTOR AND CABLES
5 INCH 720 x 1280 MIPI LCD WITH PCAP TOUCH PANEL
