TechNexion
PICOHS06M2T2020150KIT

PICOHS06M2T2020150KIT

PICO LOW-PROFILE HEATSINK 6MM + THERMOPAD WITH 1.50 MM THICKNESS FOR NXP i.MX6 UL/ULL OR i.MX6 QUAD UNLIDDED or i.MX7

Available on backorder

Quantity Price
1 - 49 $7.50
50 - 99 $7.20
100+ $7.02
x

Additional information

Shop Data
Brand

TechNexion

Country of Origin

Taiwan

HTSN

8708.91.7550

ECCN

EAR99

CCATS

740.17(b)(1) Mass Market (No License Required)

REACH / RoHS

YES

PICOHS06M Dimensions

EDMHS12M2T2020125KIT

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EDM COMPACT 12 MM PASSIVE HEATSINK + 20*20 MM THERMOPAD WITH 1.25 MM THICKNESS FOR NXP I.MX6 SOLO / DUALLITE

PICOHS06M2T2020175KIT

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PICO LOW-PROFILE HEATSINK 6MM + THERMOPAD WITH 1.75 MM THICKNESS FOR NXP i.MX8M MINI

PICOHS06M2T2020075KIT

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PICO LOW-PROFILE HEATSINK 6MM + THERMOPAD WITH 0.75 MM THICKNESS FOR NXP i.MX6 QUAD LIDDED OR i.MX8M

EDM-CONNECTOR-KIT

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10 EDM CONNECTORS + 40 STANDOFFS + 40 SCREWS

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