TechNexion’s System-on-Modules — including the EDM, AXON, and PICO families — provide a scalable foundation for embedded innovation. Powered by NXP i.MX 6, 7, 8M, and 9 processors, each module is engineered for performance, reliability, and seamless integration.
Whether you’re building smart vision systems, robotics, IoT gateways, or portable devices, our SoMs offer rich I/O, native camera support, and pre-certified wireless connectivity.
As an NXP Gold Partner, we deliver trusted quality, long-term availability, and full support for open-source Linux and Android — helping you accelerate development and reduce risk.
Board-to-Board Connectivity
AXON brings a whole arsenal of interfaces to the table to integrate into embedded systems. Built for the future. Available today.
✅ High Pin Count Interfaces
✅ Interface Superset
✅ Ideal for Drone / UAV /Robotics
260 Pin SO-DIMM Form Factor
EDM Type G Modules come with a variety of modern interfaces on a convenient 260 pin edge connector in a very compact formfactor.
✅ Low-cost single connector
✅ Linux & Android Support
✅ Ideal for General Embedded and AI
Ultra Compact – 37×40mm
PICO Modules are Compact. Small and versatile. Ideal for mobile applications with their 37 x 40 mm footprint and board to board connectors.
✅ Smallest TechNexion SoM (37x40mm)
✅ Power Efficient
✅ Ideal for Vibration prone applications
TechNexion’s Evaluation Kits (EVK) are
able to efficiently reduce the development risk and time of your embedded projects.
| Feature | AXON | EDM | PICO |
|---|---|---|---|
| Connector | 4*80-pin Hirose connectors | 260-pin Edge connectors | 70-pin Hirose connectors |
| Size | 58 x 37 mm | 69.6 x 35 mm | 37 x 40 mm |
| Key Advantages | Interface Superset | Low-cost single connector | Smallest size |
| Applications | • Edge Computing • Vehicle vision applications • Drone / UAV / Robotics | • General Embedded • Edge AI / Vision Applications • Smart manufacturing | • Small compact embedded devices • Vibration prone applications • Low-power mobile applications |