Specifications

Additional information

Core System
Processor

NXP i.MX7 Dual

Architecture

ARM Cortex-A7 + M4

PMIC

NXP PF3000

Memory

Upto 1GB DDR3L

Storage

16GB eMMC (default)

Board-to-Board Connector

Edison compatibile connector
PICO 70-pin Hirose connectors

System on Module

PICO SOM

Debug Interface

Micro USB debug

AI / Vision Capabilities
Camera

MIPI CSI (2 lanes)

Connectivity
Network LAN

1x Atheros AR8035 Gigabit LAN

Wi-Fi

Qualcomm Atheros QCA9377 Wi-Fi 5 – 802.11 a/b/g/n/ac

Bluetooth

Qualcomm Atheros QCA9377 Bluetooth

Antenna

MHF4 connector

Signaling
I/O

RS232
RGB TTL
LAN
MIPI CSI
MIPI DSI
USB
USB OTG
I²S
UART
SPI
I²C
PWM
GPIO

Video
GPU Engine

Image re-sizing / rotation / overlay and CSC Pixel Processing Pipeline

Audio
Audio Codec

NXP SGTL5000

Audio Interface

I²S (2 channel)

Audio Connectors

CTIA compliant 3.5mm audio jack

Power Specifications
Power Input

5V DC +/-5%

Power Consumption

Depending on Configuration

Power Connector

USB OTG (Type-C)

Software Support
Standard Support

Linux
Yocto
Android
Ubuntu

Extended Support

Commercial Linux

External Connectors
Network

1x RJ45

USB

1x USB 2.0 Host
1x USB 2.0 OTG (Type-C)

Buttons

1x Reset

Environmental and Mechanical
Dimensions

85.6 (W) x 56.5 (H) x 17.5 (D) mm

Weight

43 grams

Relative Humidity

10 to 90 %

MTBF

100,000+ Hours

Shock

15G half-sine 11 ms duration

Operation Temperature

Commercial: 0°C to +60°C

Vibration

1 Grms random 5-500Hz hr/axis

Certification and Compliance
FCC

FCC ID: 2AKZA-QCA9377

IC

IC: 22364-QCA9377

CE

EN 300 328 v2.2.2
EN 301 893 v2.1.1
EN 55032 / EN 55024

TELEC (Japan)

TELEC: 201-180629

RCM (Australia/New Zealand)

RCM Compliant

Certification

Compliant with RoHS / REACH directives

Bluetooth Logo

QDID 150839 (Bluetooth 4.2)
QDID 193238 (Bluetooth 5)

Commercial Information
Brand

TechNexion

Country of Origin

Taiwan

HTSN

8473.30.1180

ECCN

5A992.c Mass Market

REACH / RoHS

Yes

Block Diagram

PICO-PI-IMX7 Block Diagram

Dimensions

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