TechNexion

TEK3-IMX6UL

Additional information

Core System
Processor

NXP i.MX6UL

Processor Speed

528 Mhz

Architecture

ARM Cortex-A7

PMIC

NXP PF3000

Memory

512MB DDR3L

Storage

4GB eMMC

Connectivity
Network LAN

2x Micrel KSZ8081RNBCA Fast Ethernet LAN

Power over Ethernet

PoE function 802.3at (optional)

Video
GPU Engine

Image re-sizing / rotation / overlay and CSC Pixel Processing Pipeline

Operating Systems
Standard Support

Linux
Yocto

Extended Support

Commercial Linux

Environmental and Mechanical
Enclosure Material

Anodized Aluminium

Dimensions

168 (W) x 109 (H) x 55 (D) mm

Relative Humidity

10 to 90 %

MTBF

50,000 Hours

Shock

15G half-sine 11 ms duration

Operation Temperature

Commercial: 0° to +50° C

Vibration

1 Grms random 5-500Hz hr/axis

Weight

705 grams

Mounting Options
Surface Mounting

4 mounting holes

DIN Mounting

30mm DIN Rail Standard (DIN bracket separate purchase)

Modular Expansion Options
Power Expansion Module

TXB-P1-1030V-LAN1 (8-36V 5A)
TXB-P1-12V-LAN1 (12V 3A)
TXB-P1-12V-POE1 (12V 3A) or (PoE 802.3at)

I/O Expansion Module

TXB-I2-GS2-GC2-GG8 (Galvanic Isolated 2x RS-232 + 2x CAN + 8x GPIO)
TXB-I2-S2-C2-G8 (2x RS-232 + 2x CAN + 8x GPIO)

External Connectors
External Display

1x VGA 15-pin D-SUB

Network

2x RJ45

USB

1x USB 2.0 OTG (Type-C)
2x USB 2.0 Host

Serial Port

2x RS-232

GPIO

4x GPIO

Buttons

1x Boot Select
1x Reset

Indicators

4x programmable LEDs

SIM Cardslot

2x Micro-SIM cardslot

SD Cardslot

1x MicroSD Card Slot

Expansion Interfaces
Expansion Slots

1x M.2 slot (USB signals only)
1x mini-PCIe with Micro-SIM cardslot (USB signals only)

Certification and Compliance
Certification

Compliant with CE / FCC / RoHS / REACH directives

Commercial Information
Brand

TechNexion

Country of Origin

Taiwan

HTSN

8471.90.0000

ECCN

5A992.c Mass Market

CCATS

740.17(b)(1) Mass Market (No License Required)

REACH / RoHS

YES

TEK3-IMX6UL Block Diagram

TEK3-IMX6UL Dimensions

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