TechNexion

Highlights

Performance

As a true working horse. The NXP i.MX 6UL brings a solid up to 528Mhz 32-bit Arm Cortex-A7 architecture to your embedded device.

Software Platform

As a true opensource software advocate. TechNexion products are supported with a source code BSP Linux and Android AOSP. Third party consultants can tailor solutions easily to make every embedded project a success.

PoE

Various power modules are available. No matter your project require 9~36 VDC wide power input or Power over Ethernet. We have you covered.

M.2

Connect your TEK3 to the cloud with an internal M.2 Wireless Communication or 4G/LTE module.

I/O

The TEK3-IMX6UL comes with more interfaces than a Swiss Army Knife can pack. UARTs, CAN, GPIOs to connect devices. USB, SD for expansion and peripherals and surround audio, VGA for multimedia connectivity.

Fanless

No moving parts. No fans, loose cables and other undesired hassles that make your product unstable. The TEK3 is designed to withstand vibration prone applications as no other.

Power Saving

One of the best choices when designing a multimedia control interface when power and performance are in a stand-off and choosing sides is not an option. Take them both with the TEK3 NXP i.MX6UL.

Cost Effective

In family scalability with a single software BSP is what the NXP i.MX6UL Family is famous for. Keep your investment to a minimum and easily scale up or down as your product requirements change.

Core System
Processor

NXP i.MX6UL

Processor Speed

528 Mhz

Architecture

ARM Cortex-A7

PMIC

NXP PF3000

Memory

512MB DDR3L

Storage

4GB eMMC

Connectivity
Network LAN

2x Micrel KSZ8081RNBCA Fast Ethernet LAN

Power over Ethernet

PoE function 802.3at (optional)

Video
GPU Engine

Image re-sizing / rotation / overlay and CSC Pixel Processing Pipeline

Operating Systems
Standard Support

Linux
Yocto

Extended Support

Commercial Linux

Certification and Compliance
Certification

Compliant with CE / FCC / RoHS / REACH directives

Environmental and Mechanical
Enclosure Material

Anodized Aluminium

Dimensions

168 (W) x 109 (H) x 55 (D) mm

Relative Humidity

10 to 90 %

MTBF

50,000 Hours

Shock

15G half-sine 11 ms duration

Operation Temperature

Commercial: 0° to +50° C

Vibration

1 Grms random 5-500Hz hr/axis

Weight

705 grams

Expansion Interfaces
Expansion Slots

1x M.2 slot (USB signals only)
1x mini-PCIe with Micro-SIM cardslot (USB signals only)

External Connectors
External Display

1x VGA 15-pin D-SUB

Network

2x RJ45

USB

1x USB 2.0 OTG (Type-C)
2x USB 2.0 Host

Serial Port

2x RS-232

GPIO

4x GPIO

Buttons

1x Boot Select
1x Reset

Indicators

4x programmable LEDs

SIM Cardslot

2x Micro-SIM cardslot

SD Cardslot

1x MicroSD Card Slot

Modular Expansion Options
Power Expansion Module

TXB-P1-1030V-LAN1 (8-36V 5A)
TXB-P1-12V-LAN1 (12V 3A)
TXB-P1-12V-POE1 (12V 3A) or (PoE 802.3at)

I/O Expansion Module

TXB-I2-GS2-GC2-GG8 (Galvanic Isolated 2x RS-232 + 2x CAN + 8x GPIO)
TXB-I2-S2-C2-G8 (2x RS-232 + 2x CAN + 8x GPIO)

Mounting Options
Surface Mounting

4 mounting holes

DIN Mounting

30mm DIN Rail Standard (DIN bracket separate purchase)

Shop Data
Brand

TechNexion

Country of Origin

Taiwan

HTSN

8471.90.0000

ECCN

5A992.c Mass Market

CCATS

Mass Market (No License Required)

REACH / RoHS

YES

TEK3-IMX6UL Block Diagram
TEK3-IMX6UL Dimensions