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TEK3-IMX6UL

  • The TEK3-IMX6UL is a cost-optimized general IoT gateway for industrial applications, based on an NXP I.MX6UL core Cortex-A7™ processor.
  • Edge-computing ready with internal mini-PCIe expansion + SIM card slot for LTE/5G cloud connectivity.
  • all-aluminum heat-dissipating fanless box PC with DIN-30 and side rail mounting.
  • Orderable with single voltage 12V DC, wide voltage 9 - 36V DC or 802.3.at PoE (power over ethernet) options and GPIO, UART, CAN interfaces (optional galvanic isolated).
  • Linux and Yocto runtime images and full source code available.

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Product Brief
Developer Page
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TEK3-IMX6UL BACK
TEK3-IMX6UL FRONT

Highlights

ARM Cortex-A7

Powered by NXP i.MX 6UL application processor in ARM Cortex-A7 architecture and up to 696MHz.

Cost Saving

Scalability with a single software BSP is what the NXP i.MX6 Family is famous for. Keep your investment to a minimum and easily scale up or down to meet the product requirements.

Fanless

Reliable thermal solution without moving parts.

I/O

Rich I/O is available for extension and connection.

M.2

Supports an internal M.2 wireless communication module.

PoE

Distributes power over an Ethernet network.

Power Optimized

Distributes power over an Ethernet network.Various power modules provide a wide power input voltage range.

Software Platform

We advocate Open Source Software and support Linux, Ubuntu and Yocto. Perfect solutions to success can be tailored easily.

Core System
Processor

NXP i.MX6UL

Processor Speed

528 Mhz

Architecture

ARM Cortex-A7

PMIC

NXP PF3000

Memory

512MB DDR3L

Storage

4GB eMMC
Connectivity
Network LAN

2x Micrel KSZ8081RNBCA Fast Ethernet LAN

Power over Ethernet

PoE function 802.3at (optional)
Video
GPU Engine

Image re-sizing / rotation / overlay and CSC Pixel Processing Pipeline
Operating Systems
Standard Support

Linux
Yocto

Extended Support

Commercial Linux
Mounting Options
Surface Mounting

4 mounting holes

DIN Mounting

30mm DIN Rail Standard (DIN bracket separate purchase)
Modular Expansion Options
Power Expansion Module

TXB-P1-1030V-LAN1 (8-36V 5A)
TXB-P1-12V-LAN1 (12V 3A)
TXB-P1-12V-POE1 (12V 3A) or (PoE 802.3at)

I/O Expansion Module

TXB-I2-GS2-GC2-GG8 (Galvanic Isolated 2x RS-232 + 2x CAN + 8x GPIO)
TXB-I2-S2-C2-G8 (2x RS-232 + 2x CAN + 8x GPIO)
External Connectors
External Display

1x VGA 15-pin D-SUB

Network

2x RJ45

USB

1x USB 2.0 OTG (Type-C)
2x USB 2.0 Host

Serial Port

2x RS-232

GPIO Connector

4x GPIO

Buttons

1x Boot Select
1x Reset

Indicators

4x programmable LEDs

SIM Cardslot

2x Micro-SIM cardslot

SD Cardslot

1x MicroSD Card Slot
Environmental and Mechanical
Enclosure Material

Anodized Aluminium

Dimensions

168 (W) x 109 (H) x 55 (D) mm

Relative Humidity

10 to 90 %

MTBF

50,000 Hours

Shock

15G half-sine 11 ms duration

Operation Temperature

Commercial: 0° to +50° C

Vibration

1 Grms random 5-500Hz hr/axis

Weight

705 grams
Expansion Interfaces
Expansion Slots

1x M.2 slot (USB signals only)
1x mini-PCIe with Micro-SIM cardslot (USB signals only)
Certification and Compliance
Certification

Compliant with CE / FCC / RoHS / REACH directives
Commercial Information
Brand

TechNexion

Country of Origin

Taiwan

HTSN

8471.90.0000

ECCN

5A992.c Mass Market

CCATS

740.17(b)(1) Mass Market (No License Required)

REACH / RoHS

YES
TEK3-IMX6UL Block Diagram
TEK3-IMX6UL Dimensions

Documentation

Getting Started

Product Brief

Product Datasheet  

Quick Installation Guide

TechNexion Software Loader

OS Support

Linux

Yocto

Source Code

Linux

Yocto

Mechanical

DXF File  

STP 3D File  

Environmental

Vibration Test Report

Shock Test Report

Certification

Declaration of Conformity

RoHS / REACH

Conflict Minerals

Related Products

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TEK8021-XNX
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