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AXON-WB-IMX93

  • NXP i.MX 93 applications processor
  • Up to 2 Cortex-A55 1.7 GHz processors
  • M33 250 Mhz MCU processor
  • Arm Ethos U-65 microNPU
  • Pre-Certified Wireless Radio (Wi-Fi + Bluetooth)

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AXON-WB-IMX93 Kit
AXON-WB-IMX93 TOP
AXON-WB-IMX93 BACK

AXON-WB-IMX93 Highlights

Pin Compatibility

Scalability and cross-platform at it's finest is what sets TechNexion System-on-Modules apart. A single carrier board can host AXON System-on-Modules ranging from Texas Instruments AM62x to NXP i.MX8M Plus or i.MX 93 Family Modules.

Camera Integration

Machine Vision camera modules are ready off-the-shelf from TechNexion. Seamless integration and optimization from the first day of your project.

Software Platform

We advocate Open Source Software and support Linux, Yocto and Debian. Perfect solutions to success can be tailored easily.

Interfaces

Packed with a wide array of interfaces. Our System-on-Modules are as a Swiss Army knife when connecting over serial port, CAN bus, I2C, SPI or USB.

Certified Connectivity

Simplify your design with pre-certified wireless options - from the module to the antennas - and make end-device certification processes more predictable while cutting costs.

Specifications

Core System
Processor

NXP i.MX93

Architecture

Arm Cortex A55 + Cortex M33

PMIC

NXP PCA9451

Memory

Upto 2GB LPDDR4x

Storage

32GB eMMC (default)

Board-to-Board Connector

AXON 80-pin Hirose connectors

System on Module

AXON SOM

Debug Interface

UART Interface by Through-hole

AI / Vision Capabilities
AI / ML

NPU Ethos U-65 0.5 TOPS​

Camera

MIPI CSI (2 lanes)

Connectivity
Network LAN

2x Realtek RTL8211F

Wi-Fi

NXP IW416 Wi-Fi 4 – 802.11 a/b/g/n (optional)

Bluetooth

NXP IW416 Bluetooth (optional)

Antenna

MHF4 connector (optional)

Signaling
LVDS

1x Single Channel LVDS

TTL RGB

1x

MIPI DSI

1x

MIPI CSI2

1x

LAN

2x

USB 2.0

2x

I²S

1x

CAN

1x

UART

2x

I²C

3x

SDIO/SD/MMC

1x SDIO

GPIO

18x

TAMPER

1x

ADC

2x

Video
GPU Engine

PXP – Hardware Compositor

Audio
Audio Codec

Texas Instruments TLV320AIC3104

Audio Interface

I²S

Audio Connectors

CTIA compliant 3.5mm audio jack

Power Specifications
Power Input

12V DC +/-5%

Power Consumption

Depending on Configuration

Power Connector

DC Jack

Software Support
Standard Support

Linux
Yocto
Debian

External Connectors
External Display

1x LVDS 40-pin
1x TTL 50-pin

External Connectors

1x AUDIO JACK
1x I²C Touch

Network

2x RJ45

USB

1x USB 2.0 OTG (Type-C)
2x USB 2.0 Host

Buttons

1x Reset

SIM Card Slot

1x Micro-SIM Card Slot

SD Card Slot

1x MicroSD Card Slot

Environmental and Mechanical
Dimensions

125 (W) x 85 (H) x 26.5 (D) mm

Weight

70 grams

Form Factor

AXON

MTBF

50,000 Hours

Shock

15G half-sine 11 ms duration

Vibration

1 Grms random 5-500Hz hr/axis

Relative Humidity

10 to 90 %

Operation Temperature

Commercial: 0°C to +60°C

Expansion Interfaces
Expansion Slots

1x M.2 B-key Slot

Certification and Compliance
USA

FCC ID: 2AKZA-IW416

Canada

IC: 22364-IW416

European Union

EN 55032 / EN 55035
EN 300 328 v2.2.2
EN 301 893 v2.1.1

Japan

TELEC: 201-230590

Australia / New Zealand

RCM Compliant

Certification

Compliant with RoHS / REACH directives

Bluetooth Logo

QDID 218991 (Bluetooth 5.2)

Commercial Information
Brand

TechNexion

Country of Origin

Taiwan

HTSN

8525.80.5050

ECCN

EAR99

CCATS

740.17(b)(1) Mass Market (No License Required)

REACH / RoHS

Yes

Blockdiagram

AXON-IMX93 Block Diagram

Dimensions

AXON-WB-IMX93 Dimensions

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