PCN_ECN_banner
EDMGHS06M2T2020175KIT
EDMGHS06M2T2020175KIT

EDMGHS06M2T2020175KIT

SKU: EDMGHS06M2T2020175KIT Category:

EDM TYPE G HEATSINK PLACEHOLDER FOR I.MX8M MINI / NANO + THERMOPAD WITH 1.75 MM THICKNESS

$10.00

Quantity Discount (%) Price
1 - 49 — $10.00
50 - 99 4 % $9.60
100+ 6.4 % $9.36
x

Specifications

Additional information

Commercial Information
Brand

TechNexion

Country of Origin

Taiwan

HTSN

8708.91.7550

ECCN

EAR99

CCATS

740.17(b)(1) Mass Market (No License Required)

REACH / RoHS

Yes

Dimensions

EDMGHS06M Dimensions

You may be interested in…

TDP-0500-M7201280-PCAP

5 INCH 720 x 1280 MIPI LCD WITH PCAP TOUCH PANEL

PICOHS12M2T2020175KIT

PICO HEATSINK 12MM + THERMOPAD WITH 1.75 MM THICKNESS FOR NXP i.MX8M MINI

PICOHS06M2T2020150KIT

PICO LOW-PROFILE HEATSINK 6MM + THERMOPAD WITH 1.50 MM THICKNESS FOR NXP i.MX6 UL/ULL OR i.MX6 QUAD UNLIDDED or i.MX7

PICOHS12M2T2020150KIT

PICO HEATSINK 12MM + THERMOPAD WITH 1.50 MM THICKNESS FOR NXP i.MX6 UL/ULL OR i.MX6 QUAD UNLIDDED or i.MX7

PICOHS06M2T2020175KIT

PICO LOW-PROFILE HEATSINK 6MM + THERMOPAD WITH 1.75 MM THICKNESS FOR NXP i.MX8M MINI

EDMHS12M2T2020125KIT

EDM COMPACT 12 MM PASSIVE HEATSINK + 20*20 MM THERMOPAD WITH 1.25 MM THICKNESS FOR NXP I.MX6 SOLO / DUALLITE

SHARE YOUR CART