PICO HEATSINK 12MM + THERMOPAD WITH 1.75 MM THICKNESS FOR NXP i.MX8M MINI
TechNexion
Taiwan
8473.30.5100
EAR99
740.17(b)(1) Mass Market (No License Required)
Yes
PICO HEATSINK 12MM + THERMOPAD WITH 1.25 MM THICKNESS FOR NXP i.MX6 SOLO OR DUALLITE
EDM TYPE G CONNECTORS
EDM COMPACT 12 MM PASSIVE HEATSINK + 20*20 MM THERMOPAD WITH 1.25 MM THICKNESS FOR NXP I.MX6 SOLO / DUALLITE
USB 2.0 MICRO USB TO TYPE A CABLE 1000MM
PICO HEATSINK 12MM + THERMOPAD WITH 0.75 MM THICKNESS FOR NXP i.MX6 QUAD LIDDED OR i.MX8M
EDM TYPE G HEATSINK PLACEHOLDER FOR I.MX8M MINI / NANO + THERMOPAD WITH 1.75 MM THICKNESS