Core System |
Processor | NXP i.MX93
| Architecture | Arm Cortex A55 + Cortex M33
| PMIC | NXP PCA9451
| Memory | Upto 2GB LPDDR4x
| Storage | 32GB eMMC (default)
| Board-to-Board Connector | PICO 70-pin Hirose connectors
| System on Module | PICO SOM
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AI / Vision Capabilities |
AI / ML | NPU Ethos U-65 0.5 TOPS
| Camera | MIPI CSI (2 lanes)
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Connectivity |
Network LAN | RGMII
| Wi-Fi | NXP IW416 Wi-Fi 4 – 802.11 a/b/g/n (optional)
| Bluetooth | NXP IW416 Bluetooth (optional)
| Antenna | MHF4 connector (optional)
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Signaling |
LVDS | 1x Single Channel LVDS
| TTL | 1x
| MIPI DSI | 1x
| MIPI CSI2 | 1x
| USB 2.0 | 2x
| I²S | 2x
| UART | 2x
| I²C | 3x
| SDIO/SD/MMC | 1x SDIO
| PWM | 1x
| GPIO | 10x
| RGMII | 1x
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Video |
GPU Engine | PXP – Hardware Compositor
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Audio |
Audio Codec | On carrier board
| Audio Interface | I²S
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Power Specifications |
Power Input | 5V DC +/-5%
| Power Consumption | Depending on Configuration
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Software Support |
Standard Support | Linux Yocto Debian
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Environmental and Mechanical |
Dimensions | 40 (W) x 37 (H) x 5 (D) mm
| Weight | 8 grams
| Form Factor | PICO
| MTBF | 100,000+ Hours
| Shock | 15G half-sine 11 ms duration
| Vibration | 1 Grms random 5-500Hz hr/axis
| Relative Humidity | 10 to 90 %
| Operation Temperature | Commercial: 0°C to +60°C Industrial: -40°C to +85°C
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Certification and Compliance |
USA | FCC ID: 2AKZA-IW416
| Canada | IC: 22364-IW416
| European Union | EN 55032 / EN 55035 EN 300 328 v2.2.2 EN 301 893 v2.1.1
| Japan | TELEC: 201-230590
| Australia / New Zealand | RCM Compliant
| Certification | Compliant with RoHS / REACH directives
| Bluetooth Logo | QDID 218991 (Bluetooth 5.2)
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Commercial Information |
Brand | TechNexion
| Country of Origin | Taiwan
| HTSN | 8525.80.5050
| ECCN | EAR99
| CCATS | 740.17(b)(1) Mass Market (No License Required)
| REACH / RoHS | Yes
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