TEP-1010-IMX6 – TechNexion

Highlights

Performance

The NXP i.MX 6 Family is available in single, dual and quad core 32-bit Arm Cortex-A9, making them a cost-effective choice for a modern graphical user interface while providing sufficient power for typical industrial and multimedia applications.

Rugged and Reliable

PoE

Various power modules are available. No matter your project require 9~36 VDC wide power input or Power over Ethernet. We have you covered.

Waterproof

Designed to stand a splash of water.

Clean and disinfect your TEP product easily with a wet cloth.

Software Platform

As a true opensource software advocate. TechNexion products are supported with a source code BSP Linux and Android AOSP. Third party consultants can tailor solutions easily to make every embedded project a success.

M.2

Connect your TEP to the cloud with an internal M.2 Wireless Communication or 4G/LTE module.

I/O

The TEP-IMX6 comes with more interfaces than a Swiss Army Knife can pack. UARTs, CAN, GPIOs to connect devices. USB, SD for expansion and peripherals and surround audio, VGA and HDMI for multimedia connectivity.

Fanless

Our thermal engineers have man-years of experience designing reliability long-term conductive thermal solutions and without moving parts.

Core System

Processor	NXP i.MX6 Solo NXP i.MX6 Duallite NXP i.MX6 Quad
Architecture	ARM Cortex-A9
PMIC	NXP MMPF0100
Memory	upto 2GB DDR3
Storage	4GB eMMC

Connectivity

Network LAN	1x Atheros AR8035 Gigabit LAN
Power over Ethernet	PoE function 802.3at (optional)

Video

GPU Engine	Vivante GC2000 (Quad) Vivante GC320 (2D Composition) Vivante GC355 (Quad) Vivante GC880 (Solo/DualLite)
Video decode	1080p30 + D1 (Solo/DualLite) 1080p60 H.264 (Quad)
Video encode	1080p30 H.264 BP/Dual 720p

Audio

Audio Codec	NXP SGTL5000
Audio Connectors	1x 3.5mm jack Microphone 1x 3.5mm jack Stereo Audio in 1x 3.5mm jack Stereo Audio out

Power Specifications

Power Input	12 VDC 9-36V DC (wide power input)
Power Consumption	Depending on Configuration
Power Connector	2-pin Micro-Fit 3.0

Operating Systems

Standard Support	Linux Yocto Android Ubuntu
Extended Support	Commercial Linux

Certification and Compliance

Certification	Compliant with CE / FCC / RoHS / REACH directives

Environmental and Mechanical

Enclosure Material	Metal
Frontbezel	Brushed Anodized Aluminium
IP Rating	IP65 Front
Dimensions	263 (W) x 182 (H) x 75 (D) mm
Relative Humidity	10 to 90 %
MTBF	50,000 Hours
Shock	15G half-sine 11 ms duration
Operation Temperature	Commercial: 0° to +50° C
Vibration	1 Grms random 5-500Hz hr/axis
Weight	1900 grams

Expansion Interfaces

Expansion Slots	2x M.2 slot 2x mini-PCIe with SIM cardslot

External Connectors

External Display	1x HDMI 1x VGA 15-pin D-SUB
Network	1x RJ45
USB	1x USB 2.0 OTG (Type-C) 4x USB 2.0 Host
CAN BUS	2x Flex CAN version 2.0B compliant
Serial Port	2x RS-232
GPIO	8x GPIO
Buttons	1x Boot Select 1x Reset
Indicators	1x Programmable LED
SIM Cardslot	1x Micro-SIM cardslot
SD Cardslot	1x MicroSD Card Slot

Display

LCD	10.1 inch widescreen LCD with LED Backlight
Resolution	1280 x 800 pixels
Luminance	350 cd/m²
Maximum Colors	16.7 million
Touchscreen	Projective Capacitive (multitouch)

Modular Expansion Options

Power Expansion Module	TXB-P1-1030V-LAN1 (8-36V 5A) TXB-P1-12V-LAN1 (12V 3A) TXB-P1-12V-POE1 (12V 3A) or (PoE 802.3at)
I/O Expansion Module	TXB-I2-GS2-GC2-GG8 (Galvanic Isolated 2x RS-232 + 2x CAN + 8x GPIO) TXB-I2-S2-C2-G8 (2x RS-232 + 2x CAN + 8x GPIO)

Mounting Options