AXON-E-IMX8MLQ18-R10-E32

Name: AXON-E-IMX8MLQ18-R10-E32
SKU: AXON-E-IMX8MLQ18-R10-E32
Price: 105.00 USD
Availability: InStock

AXON SOM NXP I.MX8M PLUS QUAD 1.8GHZ + 1GB RAM + 32GB EMMC

Available on backorder

AXON Type E System-on-Module based around NXP i.MX8M Plus SoC with 1GB of LPDDR4 memory, 32GB eMMC.

Additional information

Core System

Connectivity

Network LAN	1x Atheros AR8035 Gigabit LAN

Signaling

I/O	RGMII HDMI LVDS LAN MIPI CSI MIPI DSI PCIe USB USB OTG I²S SDIO CAN UART SPI I²C PWM GPIO

Video

GPU Engine	GC520L (2D) Vivante GC7000UL
Video decode	1080p60 (h.265, h.264, VP9, VP8)
Video encode	1080p60 (h.265, h.264)
Camera	2 x ISP up to 12 MP resolution Dual MIPI CSI (4 lanes)

Audio

Audio Codec	On carrier board
Audio Interface	I²S (2 channel)

Power Specifications

Power Input	5V DC +/-5%
Power Consumption	Depending on Configuration

Operating Systems

Standard Support	Linux Yocto Android Ubuntu
Extended Support	Boot2Qt Commercial Linux

Certification and Compliance

FCC	FCC ID: 2AKZA-QCA9377
IC	IC: 22364-QCA9377
CE	EN 300 328 v2.2.2 EN 301 893 v2.1.1 EN 55032 / EN 55024
TELEC (Japan)	TELEC: 201-180629
RCM (Australia/New Zealand)	RCM Compliant
Certification	Compliant with CE / FCC / RoHS / REACH directives
Bluetooth Logo	QDID 150839 (Bluetooth 4.2)

Environmental and Mechanical

Dimensions	58 x 37 mm
Form Factor	AXON
Relative Humidity	10 to 90 %
MTBF	100,000+ Hours
Shock	15G half-sine 11 ms duration
Operation Temperature	Commercial: 0° to +60° C Industrial: -40° to +85° C
Vibration	1 Grms random 5-500Hz hr/axis
Weight	8 grams

Shop Data

Brand	TechNexion
Country of Origin	Taiwan
HTSN	8473.30.1180
ECCN	5A992.c Mass Market
CCATS	Mass Market (No License Required)
REACH / RoHS	YES

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AXON LOW-PROFILE HEATSINK 6MM + THERMOPAD WITH 1.50 MM THICKNESS FOR NXP i.MX6 UL/ULL OR i.MX6 QUAD UNLIDDED or i.MX7

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