TechNexion

FLEX-PI-IMX8M-MINI

FLEX System on Module with NXP i.MX8M Mini Evaluation Kit

FLEX System on Module with NXP i.MX8M Mini Evaluation Kit

Additional information

Core System
Processor

NXP i.MX8M Mini

Architecture

ARM Cortex-A53 + M4

AI / ML

OpenCL CPU: 32 GOPS

PMIC

ROHM BD71847

Memory

Upto 4GB LPDDR4

Storage

16GB eMMC (default)

System on Module

FLEX SOM

Debug Interface

Micro USB debug

Connectivity
Network LAN

1x Atheros AR8035 Gigabit LAN

Wi-Fi

Qualcomm Atheros QCA9377 Wi-Fi 5 – 802.11 a/b/g/n/ac

Bluetooth

Qualcomm Atheros QCA9377 Bluetooth

Antenna

MHF4 connector

Signaling
I/O

LAN
MIPI CSI
MIPI DSI
PCIe
USB
USB OTG
I²S
SDIO
UART
SPI
I²C
PWM
GPIO

Video
GPU Engine

Vivante GC Nano Ultra

Video decode

1080p60 H.264

Video encode

1080p60 H.264

Camera

MIPI CSI (4 lanes)

Audio
Audio Codec

Cirrus Logic WM8960

Power Specifications
Power Input

5V DC +/-5%

Power Consumption

Depending on Configuration

Operating Systems
Standard Support

Linux
Yocto
Android
Ubuntu

Certification and Compliance
FCC

FCC ID: 2AKZA-QCA9377

IC

IC: 22364-QCA9377

CE

EN 300 328 v2.2.2
EN 301 893 v2.1.1
EN 55032 / EN 55024

TELEC (Japan)

TELEC: 201-180629

RCM (Australia/New Zealand)

RCM Compliant

Certification

Compliant with CE / FCC / RoHS / REACH directives

Bluetooth Logo

QDID 150839 (Bluetooth 4.2)

Environmental and Mechanical
Relative Humidity

10 to 90 %

MTBF

50,000 Hours

Shock

15G half-sine 11 ms duration

Operation Temperature

Commercial: 0° to +60° C

Vibration

1 Grms random 5-500Hz hr/axis

Weight

50 grams

External Connectors
Network

1x RJ45

USB

1x USB 2.0 Host
1x USB 2.0 OTG (Type-C)

Buttons

1x Reset

SD Cardslot

1x MicroSD Card Slot

Shop Data
Brand

TechNexion

Country of Origin

Taiwan

HTSN

8473.30.1180

ECCN

5A992.c Mass Market

CCATS

Mass Market (No License Required)

REACH / RoHS

YES

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