Accelerated product development with complete embedded solutions

Developing an embedded product is challenging. From identifying a problem and coming up with a product idea to choosing the right components and building the prototype, there are miles to travel before you reach the destination – launching the product to the market. Some key challenges embedded product developers face include:

Developing a system with individual components (i.e. chip-down) can take man-years
Employing expertise for embedded systems design, from specialized hardware engineering to embedded software platform development engineering
Differentiating your product with limited engineering resources.
Maintaining the embedded system, including EOL issues and near-continuous software updates.

All these can lead to delays in bringing the product to the market, which in turn can cause a huge impact on the revenue and profit goals of the business.

How can this challenge be overcome? Enterprises can set up large internal teams with huge budgets which startups and mid-size companies cannot afford.

Another option is to use a trusted solutions partner with the right mix of product portfolio and engineering expertise to support your project development goals. This is where TechNexion can help. With products including edge AI modules, embedded cameras, and customized ODM products, we support our customers with all aspects of taking their products to market.

In this article, we discuss TechNexion’s suite of solutions for embedded product developers, especially in the domains of robotics, industrial automation, smart city, and agriculture.

TechNexion’s solutions for the embedded systems world

TechNexion has been in the embedded systems space since 2001. What started as a simple embedded product design company has now grown into a pioneer in its domain with 140+ employees and 100+ products. With continuous investment in R&D and technology, we have been able to meet the product and quality standards of some of the leading brands in the world. This was possible only through building a comprehensive product portfolio consisting of:

System on modules
Embedded cameras
Edge AI computing modules
Cloud and connectivity solutions
Robotics solutions

System on modules

TechNexion’s system on modules are designed by keeping modern and futuristic applications in mind. They come with a wide variety of interfaces and I/O for sensory input, HMI (human machine interface), control, and edge processing. Our portfolio of system on modules includes:

AXON Modules: At 58x37mm, AXON modules are designed for applications that require the highest amount of input and output options in the smallest space. They stand at just 37×58 mm with a PCB-footprint optimized board-to-board connector. AXON modules are suitable for AI acceleration by utilizing the processing capabilities of NXP i.MX8M, NXP i.MX93, and i.MX95.

AXON-IMX93 – NXP i.MX 93 system on module

EDM System on Modules: The EDM Modules employ a 260-pin LPDDR4 SO-DIMM edge connector, providing a broad range of interfaces to enable a cost-efficient and exceptionally reliable connection that is resistant to shock and vibration. They are known for their ease of use and robustness.
PICO modules: Launched in 2014, PICO modules provide pin-to-pin compatibility from low-cost single-core i.MX6UL to the 64-bit quad-core i.MX8M Mini. At just 37x40mm, this is the smallest form factor, suitable for mobile applications.

TechNexion also offers evaluation kits that can bring down the overall cost and time of the development processes. Visit the system on modules page to learn more about our solutions.

Embedded cameras

Embedded cameras are one of the latest additions to TechNexion’s portfolio which is a result of more than 5 years of consistent research and development. Here are some of the notable features of TechNexion’s camera modules:

Resolution ranging from 1MP to 13MP
Global shutter and rolling shutter variants
Compatibility with NXP, TI, NVIDIA, Renesas and Intel processors
USB, MIPI, and FPD-Link III (and soon GMSL2 and FPD-Link IV) interfaces
High dynamic range
Near Infrared optimization
Low light sensitivity

With these features, our camera solutions are suitable for next-gen embedded vision applications like robotics, drones, smart traffic systems, precision agriculture, and more. We also offer connectors and cables required to connect the camera to the host processing system. Please visit the embedded vision cameras page to explore our camera portfolio.

FPDLINK-III PCB Board Camera with onsemi AR0822 8MP 4K Rolling Shutter with Onboard ISP and S-mount Lens

In stock Out of stock On backorder

UVLS3-AR0822-SL

onsemi AR0822 8MP Rolling Shutter Sensor
4K HDR Imaging Capabilities
Near Infra-Red Enhancement for Outdoor Applications
Designed for Low Light Applications
S-Mount for Interchangeable Lenses
FAKRA Automotive Connector
Plug & Play with Linux OS & Yocto
Comes with VizionViewer™ Configuration Utility and VizionSDK

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Sensor	onsemi AR0822
Shutter	Rolling
Megapixels	8MP
Chromaticity	Color, Monochrome
Interface	FPD-Link III

View Product

Edge AI computing modules

One of the key objectives of TechNexion is to make the development process easy for its customers. Using our ready-to-use edge computing modules like TEK6100-ORIN-NX (a 100 TOPS embedded computing module) makes this possible. Based on the NVIDIA Jetson Orin NX, it supports up to 8 FPD-Link III cameras, making it suitable for multi-camera applications.

In addition to TEK6100-ORIN-NX, TechNexion also offers edge AI computing modules based on NVIDIA Jetson Orin Nano and Xavier NX. Check out our embedded computing page for details.

TEK6100-ORIN-NX – NVIDIA Orin NX edge AI module

Panel computing solutions

These are display solutions from TechNexion that can be used in industrial, medical, and retail applications. They come with PoE (Power over Ethernet) support with the ability to transmit power and data over the same cable. The other key features of TechNexion’s panel computing solutions include:

High resolution and luminance
Different mounting setups (Rear, VESA, and surface mounting)
264 video encoding and decoding
LCD screens in different sizes
HDMI and USB2.0 external connectors
CE, FCC, RoHS, and REACH compliance
Metal enclosures

To learn more about our display panels, visit the panel computing page.

TC-0700 – Small form factor panel based on the NXP i.MX6 processor

Cloud and connectivity

This category consists of modules that enable connectivity through various mediums such as Bluetooth and Wi-Fi. TechNexion’s connectivity modules are lightweight with a small form factor while still ensuring ruggedness and security.

For instance, STIX-9377-M2-AE uses Qualcomm Atheros QCA9377 Wi-Fi 5 and Qualcomm Atheros QCA9377 Bluetooth for Wi-Fi and Bluetooth connectivity respectively. In addition to this, our portfolio contains 7 more solutions that would meet the connectivity needs of most modern embedded systems.

STIX-9377-M2-AE – Qualcomm QCA-9377 module

Robotics

Robotics is one of the focus applications of TechNexion. From cameras to panels and embedded computing modules, we have a full suite of offerings for different kinds of robotic applications.

One of the flagship products of TechNexion for robotic systems is ROVY-4VM, a TI-TDA4VM-based edge AI module. The ROVY-4VM is a complete robotic processor in a small computing module, featuring real time edge AI, a plethora of industrial I/O, and real-time fast control processors.

ROVY-4VM

To understand how ROVY-4VM can perfectly suit your robot, have a look at the below architectural diagram of a ROVY-based AMR (Autonomous Mobile Robot) system:

As you can see, ROVY-4VM combines various elements such as the compute processing module, safety unit, and accelerated vision processor into a single system that robot developers can readily plug into their system with minimal integration effort. Instead of having to develop or source each component separately, you get an all-in-one system that can significantly reduce your time to market and TCO (Total Cost of Ownership).

Here are a few more key features of ROVY-4VM that will help accelerate your product development:

Ability to connect to 8 FPD-Link III cameras
Accelerated video preprocessing with a motion and stereo processing engine
Shock and vibration resistant
264 video decode/encode

Visit the ROVY-4VM page for more details.

How TechNexion enables accelerated embedded product development

Unlike many of our competitors, TechNexion focuses on offering a complete ecosystem to its customers by developing and supplying products that meet multiple component needs. For example, imagine you are a robotics company developing a telepresence robot used for remote teaching, doctor-patient interactions, and other forms of remote communication.

Here, TechNexion can offer its high-resolution cameras (up to 13MP) for imaging and video recording while ROVY-4VM or TEK6100-ORIN-NX can be used as the edge AI computing module (the choice between the two modules will depend on the specific requirements of the application). We can also offer the panel display needed for video communication. Further, our portfolio includes IP68 enclosures and mount brackets for cameras that can protect and fit them into position.

Below are the other value adds TechNexion brings to the table:

Customization support to ensure our solutions are tailored to your device.
Support for choosing the right lens for your system.
Unmatched engineering expertise developed through two decades of embedded product development.
Integration support for cameras, panels, and embedded computing solutions.
A state-of-the-art manufacturing facility that is equipped with the PoP (Package on Package) technology with the ability to do large-scale production.

In essence, we bring a complete package to you – from world-class products to the right amount of integration and customization support. To learn how TechNexion can help your business grow by accelerating the development of your vision-based product, talk to one of our experts today.