TechNexion

FLEX-IMX8M-MINI

FLEX System on Module based around NXP i.MX8M Mini

  • Modern System on Module form factor
  • Up to four Cortex-A53 1.8 GHz processors
  • NXP i.MX 8M Mini applications processor
  • Armv8 64-Bit CPU cores

Additional information

Core System
Processor

NXP i.MX8M Mini

Architecture

ARM Cortex-A53 + M4

AI / ML

OpenCL CPU: 32 GOPS

PMIC

ROHM BD71847

Memory

Upto 4GB LPDDR4

Storage

16GB eMMC (default)

Board-to-Board Connector

260-pin DDR4 SO-DIMM

System on Module

FLEX SOM

Debug Interface

JTAG Interface by Through-hole

Connectivity
Network LAN

1x Atheros AR8035 Gigabit LAN

Wi-Fi

Qualcomm Atheros QCA9377 Wi-Fi 5 – 802.11 a/b/g/n/ac (optional)

Bluetooth

Qualcomm Atheros QCA9377 Bluetooth (optional)

Antenna

MHF4 connector (optional)

Signaling
I/O

LAN
MIPI CSI
MIPI DSI
PCIe
USB
USB OTG
I²S
SDIO
UART
SPI
I²C
PWM
GPIO

Video
GPU Engine

Vivante GC Nano Ultra

Video decode

1080p60 H.264

Video encode

1080p60 H.264

Camera

MIPI CSI (4 lanes)

Audio
Audio Codec

On carrier board

Audio Interface

I²S (2 channel)

Power Specifications
Power Input

5V DC +/-5%

Power Consumption

Depending on Configuration

Operating Systems
Standard Support

Linux
Yocto
Android
Ubuntu

Certification and Compliance
FCC

FCC ID: 2AKZA-QCA9377

IC

IC: 22364-QCA9377

CE

EN 300 328 v2.2.2
EN 301 893 v2.1.1
EN 55032 / EN 55024

TELEC (Japan)

TELEC: 201-180629

RCM (Australia/New Zealand)

RCM Compliant

Certification

Compliant with RoHS / REACH directives

Bluetooth Logo

QDID 150839 (Bluetooth 4.2)

Environmental and Mechanical
Dimensions

69.6 x 35mm

Form Factor

FLEX

Relative Humidity

10 to 90 %

MTBF

100,000+ Hours

Shock

15G half-sine 11 ms duration

Operation Temperature

Commercial: 0° to +60° C
Industrial: -40° to +85° C

Vibration

1 Grms random 5-500Hz hr/axis

Weight

8 grams

FLEX-IMX8M-MINI Block Diagram

FLEX-IMX8M-MINI Dimensions

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