TechNexion plans to unveil an array of next-generation devices.
TechNexion, one of the most respected and fastest growing embedded systems solution providers, will participate in embedded world exhibition and conference 2018, underscoring its commitment to helping companies of all sizes as they take their technology innovations from idea to design to production. TechNexion will showcase next generation System on Modules, embedded mainboards, fanless computing, panel computing and Internet of Things devices along with other solutions at the annual embedded world exhibition and conference to be held February 27 to March 1, in Nürnberg, Germany. This year, TechNexion booth will be located in Hall 1, Stand 1-311.
About embedded world
At Exhibition Centre Nürnberg in February 2018, embedded systems will once again be the focus of embedded world Exhibition & Conference, the leading international fair for the sector. Embedded experts from around the world gather in Nuremberg to network and showcase their innovative solutions to meet the challenges of the future. The exhibition takes place in Nürnberg, Germany every year in February or March.
TechNexion offers a wide range of embedded modular solutions to leading OEM/ODM companies in the multimedia, communication, security, automation and process control industries. TechNexion continuous investment in production technology and state-of-the-art equipment upgrades make it possible to meet technically increasingly complex customer demand. TechNexion products range from Systems on Module, Embedded Mainboards, Fanless Computing, Panel Computing to Internet of Things. All products and solutions are backed up with unmatched longevity, open hardware documentation and open source software.
TechNexion is a ISO-9001 and ISO-14001 certified company and is a founding member of the EDM (Embedded Design Modules) Standard.
For more information, visit www.technexion.com.