TechNexion makes a big splash at embedded world with next generation embedded systems and other new products

Nürnberg, Germany – TechNexion today unveiled its next-generation System on Modules, Embedded Mainboards, Fanless Computing, Panel Computing and Internet of Things devices along with other solutions at the annual embedded world exhibition and conference in Nürnberg, Germany. Customers can meet some of the people behind our latest innovations and get a first-look at what our next generation product can do for them. This year, TechNexion booth is located at Hall 1, Stand 1-311.

TechNexion product line-up has grown once again in size. For this year’s embedded world show, TechNexion continues to build on its complete lineup of EDM and PICO Series System on Modules designed for modular, versatile, scalable and low-power applications. We are also launching several multi-mode wireless communication modules, PIXI Series, that deliver better transmission rates, lower latency, better range and higher resistance to interference. Static and live demos are showcasing the latest TEP and TWP Series human-machine-interface (HMI) panel computing devices. The TEP Series is available with either ARM or x86 architecture and a flux mounted projective capacitive touch with high brightness LCD display ranging from 5 to 15.6 inches embedded in an IP65 anodized aluminum enclosure. For the first time, TechNexion presents TWP Series waterproof panel PCs with robust features, able to withstand extreme temperatures, high vibration and high humidity environments also with either ARM or x86 architecture. In addition to TechNexion robust lineup of SOM’s, IoT modules and HMI’s, the company is launching several new fanless industrial Box PCs. The TEK Series fanless computing systems are enclosed in a compact, fully ruggedized enclosure, and are perfect for controlling versatile end-equipment. Besides, for those who missed out Embedded World – we’ve got a good news, ARMdevices.net has just posted a terrific TechNexion booth tour video!

About embedded world Exhibition & Conference

At Exhibition Centre Nuremberg in February 2018, embedded systems will once again be the focus of embedded world Exhibition & Conference, the leading international fair for the sector. Embedded experts from around the world gather in Nürnberg to network and showcase their innovative solutions to meet the challenges of the future. The exhibition takes place in Nürnberg, Germany every year in February or March.

About TechNexion

TechNexion offers a wide range of embedded modular solutions to leading OEM/ODM companies in the multimedia, communication, security, automation and process control industries. TechNexion continuous investment in production technology and state-of-the-art equipment upgrades make it possible to meet technically increasingly complex customer demand. TechNexion products range from Systems on Module, Embedded Mainboards, Fanless Computing, Panel Computing to Internet of Things. All products and solutions are backed up with unmatched longevity, open hardware documentation and open source software.

TechNexion is a ISO-9001 and ISO-14001 certified company and is a founding member of the EDM (Embedded Design Modules) Standard.
For more information, visit www.technexion.com.

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