Today, we are excited to announce that Google along with releasing Developer Preview 4 of Android Things, added a new Board Support Package to the TechNexion PICO-PI-IMX7.
The goal of Android Things is to enable Android developers to quickly build smart devices, and seamlessly scale from prototype to production using a Board Support Package (BSP) provided by Google. Today, Google is adding a new Board Support Package for the PICO-PI-IMX7, which supports higher performance than PICO-PI-IMX6UL while still using a low power System on Module design. TechNexion PICO-PI-IMX7 is a highly integrated multi-market applications system with advanced features designed to enable secure and portable applications within the Internet of Things. This hardware platform has been qualified and tested by Google to run Android Things at optimal performance.
Included in the pack is a USB Type-C cable for powering the board and for ADB usage.
NXP i.MX7 Solo and Dual options.
WiFi 802.11ac and Bluetooth v. 4.1 communication interfaces.
Compatible with Intel Edison baseboards.
Additional high-speed signals such as RMII LAN, USB and 24 bit TTL Display.
Linux, Android, Ubuntu and Yocto source code.
Open carrier board specifications, design guides, and schematics.
Pre-loaded plug and play start kits.
12-year longevity guarantee.
PICO-IMX7 is part of the Pico SoM series, an ultra-compact form factor SoM optimized for mobile devices and IoT. Pico is equipped with a wide array of high-speed connectivity options engineered to support IoT endpoints, wearable applications, appliances, drones or industrial mobile terminals.
And we will have more news for Android Things developers, who are getting ready to head to San Francisco for the Google I/O 2017 conference starting tomorrow.
About Android Things
Android Things is a new version of Android aimed at enabling faster development of secure connected devices for the Internet of Things (IoT). Android Things is a lightweight embedded OS that includes Weave, a communication protocol, that enables both local and cloud connectivity over multiple wireless protocols.
TechNexion offers a wide range of embedded modular solutions to leading OEM/ODM companies in the multimedia, communication, security, automation and process control industries. TechNexion continuous investment in production technology and state-of-the-art equipment upgrades make it possible to meet technically increasingly complex customer demand. TechNexion products range from Systems on Module, Embedded Mainboards, Fanless Computing, Panel Computing to Internet of Things. All products and solutions are backed up with unmatched longevity, open hardware documentation and open source software.
TechNexion is a ISO-9001 and ISO-14001 certified company and is a founding member of the EDM (Embedded Design Modules) Standard.
For more information, visit www.technexion.com.