For this year’s Computex Taipei, TechNexion will be showcasing smart and connected development platforms designed to enable energy-efficient, secure and portable IoT industrial applications.
TechNexion plans to unveil an array of next-generation Internet of Things modules, System on Modules, Embedded Mainboards, Fanless Computing and Panel Computing devices along with Android Things development kits at the annual Computex Taipei trade show to be held June 5 to June 9, in Taipei, Taiwan. This year, TechNexion booth will be located in Nangang Exhibition Hall 1, Ground Level, Stand J0130.
About Computex Taipei
Since 1981 Computex Taipei has been one of the world’s leading B2B ICT and IoT trade shows. While evolving in sync with global ICT industry trends, the show is predominantly about computing and positions itself as a global startup platform, focusing on five main themes: IoT Applications, Business Solutions, AI & Robotics, Innovations & Startups, and Gaming & VR. The exhibition takes place in Taipei, Taiwan every year in May or June.
TechNexion offers a wide range of embedded modular solutions to leading OEM/ODM companies in the multimedia, communication, security, automation and process control industries. TechNexion continuous investment in production technology and state-of-the-art equipment upgrades make it possible to meet technically increasingly complex customer demand. TechNexion products range from Systems on Module, Embedded Mainboards, Fanless Computing, Panel Computing to Internet of Things. All products and solutions are backed up with unmatched longevity, open hardware documentation and open source software.
TechNexion is a ISO-9001 and ISO-14001 certified company and is a founding member of the EDM (Embedded Design Modules) Standard.
For more information, visit www.technexion.com.