TechNexion shows off embedded products at SPS IPC Drives Nürnberg 2018

At this year’s SPS exhibition, TechNexion unveils a wide range of its cutting-edge industrial systems and customers can meet some of the people behind our latest innovations and get a first-look at what our next generation product can do for them. The show runs until November 29, 2018.

A range of hands-on demonstrations focuses on TechNexion’s latest products for key target markets. TechNexion showcases the complete lineup of panel and fanless computing devices, single board computers along with computing system on modules, pre-certified Internet of Things modules, and Android Things (based on NXP i.MX7) or Amazon AVS (based on NXP i.MX8M) development kits at this year SPS. We are looking forward to meeting you at our booth 8-401, located in Hall 8.

TechNexion continues to build on its complete lineup of TEP series HMI panel computing devices based on NXP i.MX6, i.MX7 or Intel Braswell, Apollo Lake series processors. The TEP series features a flux mounted projective capacitive touch with high brightness LCD display ranging from 5 to 15.6 inches embedded in an IP65/NEMA4x rated brushed aluminum bezel design. On the other hand, TWP waterproof series comes with an IP69K rated stainless steel enclosure ranging from 10.1 to 15.6 inches. In addition to TechNexion robust lineup of HMI’s, the company is expanding the line of fanless industrial box PCs. The TEK series fanless computing systems based on either ARM (NXP i.MX6) or x86 (Intel Braswell, Apollo Lake) architecture are enclosed in a fully ruggedized enclosure and are perfect for controlling versatile end-equipment in diverse industrial environments.

In addition, the company is showcasing the latest PICO and EDM series system on modules designed for modular, versatile, scalable and low-power applications that can be easily integrated into other devices. The modules are based on NXP i.MX6, i.MX7 and i.MX8M series applications processors. Connectivity product group showcases pre-certified (CE, FCC, IC, RCM and TELEC) wireless communication modules based on Qualcomm QCA 9377 and QCA6174 chipsets. These tiny modules enable secure, low-energy and long-range connectivity for smart IoT devices like home and building automation, vending machines, agriculture climate control systems or healthcare equipment.

About SPS IPC Drives

SPS IPC Drives is Europe’s leading exhibition for electronic automation. This trade show is a professional platform for presentation and communication, where suppliers of electronic automation technology can showcase their latest solutions. The exhibition takes place in Nuremberg, Germany very year in November.

About TechNexion

TechNexion offers a wide range of embedded modular solutions to leading OEM/ODM companies in the multimedia, communication, security, automation and process control industries. TechNexion continuous investment in production technology and state-of-the-art equipment upgrades make it possible to meet technically increasingly complex customer demand. TechNexion products range from Systems on Module, Embedded Mainboards, Fanless Computing, Panel Computing to Internet of Things. All products and solutions are backed up with unmatched longevity, open hardware documentation and open source software.

TechNexion is a ISO-9001 and ISO-14001 certified company and is a founding member of the EDM (Embedded Design Modules) Standard.
For more information, visit

Stay up to date with all the latest TechNexion news...

Sign-up for our Newsletter