TechNexion to kick off electronica München 2018

Customers and other attendees once again get the chance to get up-close and personal with TechNexion at the biennial electronica 2018 trade show in Munich, Germany. The show runs until November 16, 2018.

A range of hands-on demonstrations focuses on TechNexion’s latest products for key target markets. TechNexion showcases the complete lineup of next-generation system on modules, pre-certified Internet of Things modules, embedded mainboards, fanless computing and panel computing devices along with Android Things (based on NXP i.MX7) or Amazon AVS (based on NXP i.MX8M) development kits at this year electronica Munich. We are looking forward to meeting you at our booth 364, located in Hall B5.

TechNexion continues to build on its complete lineup of PICO and EDM series System on Modules designed for modular, versatile, scalable and low-power applications that can be easily integrated into other devices. The modules are based on NXP i.MX6, i.MX7 and i.MX8M series applications processors. Internet of Things product group showcases pre-certified (CE, FCC, IC, RCM and TELEC) wireless communication modules based on Qualcomm QCA 9377 and QCA6174 chipset. These tiny modules enable secure, low-energy and long-range connectivity for smart IoT devices like home and building automation, vending machines, agriculture climate control systems or healthcare equipment.

Static and live demos will be showcasing the latest TEP / TWP Series human-machine-interface (HMI) panel computing devices based on NXP i.MX6, i.MX7 or Intel Braswell, Apollo Lake series processors. The TEP series features a flux mounted projective capacitive touch with high brightness LCD display ranging from 5 to 15.6 inches embedded in an IP65/NEMA4x rated brushed aluminum bezel design. On the other hand, TWP series comes with an IP69K rated stainless steel enclosure ranging from 10.1 to 15.6 inches. In addition to TechNexion robust lineup of SOM’s and HMI’s, the company is expanding the line of new fanless industrial Box PCs. The TEK series fanless computing systems based on ARM or x86 architecture are enclosed in a fully ruggedized enclosure and are perfect for controlling versatile end-equipment.

About electronica München

Every two years, electronica brings the entire world of electronics including components, systems and applications together in Munich—whether start-ups, small and medium-sized enterprises or international corporations. And no wonder: As the most important international industry gathering, electronica attracts visitors from all important branches of the electronics industry. The exhibition takes place in Munich, Germany every two years in November.

About TechNexion

TechNexion offers a wide range of embedded modular solutions to leading OEM/ODM companies in the multimedia, communication, security, automation and process control industries. TechNexion continuous investment in production technology and state-of-the-art equipment upgrades make it possible to meet technically increasingly complex customer demand. TechNexion products range from Systems on Module, Embedded Mainboards, Fanless Computing, Panel Computing to Internet of Things. All products and solutions are backed up with unmatched longevity, open hardware documentation and open source software.

TechNexion is a ISO-9001 and ISO-14001 certified company and is a founding member of the EDM (Embedded Design Modules) Standard.
For more information, visit www.technexion.com.

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