Taipei, Taiwan – TechNexion is set to launch a broad range of next-generation Internet of Things modules, System on Modules, Embedded Mainboards, Fanless Computing and Panel Computing devices along with Android Things development kits at the annual Computex Taipei trade show to be held June 5 to June 9, in Taipei, Taiwan. This year, TechNexion booth is located in Nangang Exhibition Hall 1, Ground Level, Stand J0130.
TechNexion continues to build on its strong lineup of PICO and EDM series System on Modules designed for industrial applications based on NXP i.MX6, i.MX7 and i.MX8M applications processors families. The modules are especially designed for modular, versatile, scalable and low-power applications that can be easily integrated into other devices. The company showcases a Google certified and cost-effective Android Things development platform based on NXP i.MX7 Dual application processor. In addition to PICO and EDM series, developers can take advantage of numerous plug-in PIXI or CLIX series wireless communication modules and development boards that are certified by the most critical government agencies, including European Union (CE, ETSI), United States (FCC), Canada (CI), Japan (TELEC) and Australia/New Zealand (RCM).
With its finger of the pulse of IoT markets, TechNexion’s impending line of embedded systems is designed to optimize entire businesses. TechNexion’s modular embedded systems based on either ARM (NXP i.MX6, i.MX7 and i.MX8M) or x86 (Intel Braswell and Apollo Lake) architecture not only continue to revolutionize performance, scalability, durability and power efficiency, but also address a wide range of industrial applications. The modular TEP and waterproof TEK panel computing devices are designed to enable operation and maintenance in diverse industrial environments. The TEK series fanless computing systems are enclosed in a compact, fully ruggedized enclosure, and are perfect for controlling versatile end-equipment.
About Computex Taipei
Since 1981 Computex Taipei has been one of the world’s leading B2B ICT and IoT trade shows. While evolving in sync with global ICT industry trends, the show is predominantly about computing and positions itself as a global startup platform, focusing on five main themes: IoT Applications, Business Solutions, AI & Robotics, Innovations & Startups, and Gaming & VR. The exhibition takes place in Taipei, Taiwan every year in June.
TechNexion offers a wide range of embedded modular solutions to leading OEM/ODM companies in the multimedia, communication, security, automation and process control industries. TechNexion continuous investment in production technology and state-of-the-art equipment upgrades make it possible to meet technically increasingly complex customer demand. TechNexion products range from Systems on Module, Embedded Mainboards, Fanless Computing, Panel Computing to IoT wireless communication modules. All products and solutions are backed up with unmatched longevity, open hardware documentation and open source software.
TechNexion is a ISO-9001 and ISO-14001 certified company and is a founding member of the EDM (Embedded Design Modules) Standard.
For more information, visit www.technexion.com.