TDM-3730 System on Module

  tdm-3730
TI DM3730 application processor with ARM Cortex-A8 CPU and POWERVR SGX 530 for 2D and 3D graphics acceleration.
200 pin SO-DIMM connector carrying LAN, USB, UART, SPI, I2C, LCD Camera signals making the TDM-3730 ideal for industrial and multimedia usage.
Board Support Packages (BSP) available to create your own applications ranging from Windows CE to Linux and Android.
 

pdfDatasheet            folderDocumentation and Support



Specifications

CPU TI Sitara DM3730 @ 1Ghz
DSP Core TMS320C64x+™ @ 800Mhz
Memory 512 MB Low Power DDR (other configurations available upon request)
Storage 512 MB NAND Flash
Wireless LAN 802.11b/g
Supported OS Linux 2.6.x, Windows Embedded Compact 7 and Android
 

Interfaces

Connectors 200 pin SO-DIMM
SPI, UART, USB host, USB OTG/client,
I2C, PWM lines, 1-wire, MMC lines,
A/D lines, camera, audio in/out, mic
keypad, S-Video, Display interface, LAN
 

Graphic Capabilities

Chipset POWERVR SGX 530
20Mpolys/s, up to 720p resolution
API support OpenGL 2.0, OpenGLes 1.1, OpenVG 1.0
 

Power

Power consumption <2.0 Watt with Wireless enabled
Standby <50 mWatt
Power requirements 5V
 

Environmental and Mechanical

Temperature Commercial: 0° to 70° C
Extended: -20° to 70° C
Industrial: -40° to 85° C
Humidity 10-90%
Dimensions 67.6 x 50 x 3.4 mm
2⅝ x 2 x ¼ inch
MTBF >100,000 hours
Weight 12 grams
Shock 50G / 25ms
Vibration 20G / 0-600 Hz
 

Dimensional drawing

all sizes in mm

tdm-3730size

 

Block Diagram

tdm-3730-block-diagram

 

Order information

TDM-3730 DM3730 system on module
TDM-3730W DM3730 system on module with Wireless LAN 802.11 b/g
 
Other configurations such as different CPU, optional interfaces and storage capacities on project basis and subject to minimum order quantities.